1pcs Beryllium Oxide Ceramic Sheets - Exceptional Thermal Conductivity & Electrical Insulation for Advanced use

MATERIAL COMPOSITION: High-purity beryllium oxide ceramic sheets engineered for superior thermal conductivity and electrical insulationBeryllium oxide ceramics, due to their high thermal conductivity, high melting point, high strength, high insulation, low dielectric constant, low dielectric loss and good adaptability to packaging processes, pure beryllium oxide can insulate like ceramics but also conduct heat like metalsBeryllium oxide belongs to the cubic crystal system, with a density of 3.03g/cm ³ and a melting point of 2570 ° C. It has a very high thermal conductivity, with a thermal conductivity coefficient of 200-250W/(m · K), and a dielectric constant of 6-7 (0.1MHz)Ceramics with beryllium oxide as the main component have increased volatility in high-temperature media. As the temperature rises, the amount of evaporation increases. The product has excellent performance and a large demandCeramic sheets are thin slices or blocks made of ceramic materials, featuring high strength, high temperature resistance, and good insulation. The ceramic surface is smooth and has different electrical and thermal conductivities

• Engineered from high-purity beryllium oxide, these ceramic sheets offer outstanding thermal conductivity (200-250W/(m·K)) and electrical insulation, making them ideal for demanding applications.
• With a melting point of 2570 °C, these sheets are devised to perform excellently in high-temperature environments, ensuring reliability and durability.
• Low dielectric constant and loss characteristics make these beryllium oxide ceramics perfect for electronic packaging and insulation solutions, enhancing performance in advanced technology sectors.
• The smooth ceramic surface provides high strength and durability, suitable for various industrial applications where performance and reliability are critical.
• Versatile and dependable, these ceramic sheets meet the growing demand for materials, ensuring superior adaptability in high-temperature media and packaging processes.