Aluminum Nitride (AlN) Ceramic Substrate Sheet, 2 Inch 50.8 x 50.8 mm, 0.635mm Thick, Polished Ceramic Heat Spreader for Semiconductor, GPU and AI Hardware Thermal Management, 1 Pack

Aluminum Nitride (AlN) Ceramic Substrate Sheet This Aluminum Nitride ceramic substrate sheet is designed for electronic thermal management applications that require both high thermal conductivity and electrical insulation. The solid AlN ceramic plate helps transfer heat efficiently while maintaining electrical insulating properties, making it suitable for engineering, prototyping, and industrial electronic projects. Product Features: - Material: Aluminum Nitride (AlN) ceramic - Size: 2 inch square, 50.8 x 50.8 mm - Thickness options: 0.635mm and 1.0mm - Package options: 1 Pack and 5 Pack - Thermal conductivity: ≥170 W/m·K - Smooth polished ceramic surface - Electrical insulating ceramic material Typical Applications: Suitable for LED modules, power electronics, semiconductor thermal management, laser devices, PCB projects, thermal interface testing, and industrial electronic assemblies where heat dissipation and electrical insulation are both required. Please choose the correct variation before purchase: 0.635mm / 1 Pack Note: Please confirm the required thickness and quantity before ordering. This product is a rigid ceramic substrate sheet, not a soft silicone thermal pad.

• 1️⃣High Thermal Conductivity: Aluminum Nitride (AlN) ceramic provides ≥170 W/m·K thermal conductivity, helping transfer heat efficiently in electronic thermal management applications.
• 2️⃣Electrical Insulation: Combines high thermal conductivity with electrical insulating properties, suitable for applications where heat dissipation and insulation are both required.
• 3️⃣Precise 2 Inch Size: 50.8 x 50.8 mm square ceramic substrate, 0.635mm thick, 1 piece per pack for testing, prototyping, and small electronic projects.
• 4️⃣Polished Ceramic Surface: Smooth polished finish helps provide consistent surface contact with components, thermal interfaces, and electronic assemblies.
• 5️⃣Wide Application Use: Suitable for LED heat dissipation, power electronics, semiconductor thermal management, laser devices, PCB projects, GPU/AI hardware prototyping, and industrial electronic assemblies.