WALFRONT 0.4mm Tin Balls BGA Leadfree Solder Balls for PCB Board Rework Reballing Accessories Laptop Phone Repair 25W

Spec: Item Type:Solder Ball Material: Sn96.5% / Ag3% / Cu0.5% Specification: Approx.0.4mm / 0.016in 250,000 grains Application: Suitable for Chip BGA reballing, BGA package soldering, filling, maintenance packing list: 1 x Bottle of Tin Balls

• [Enhanced Reliability] Trace elements are added to these solder balls to significantly improve their oxidation resistance and overall reliability.
• [Precise Size & Quality] The diameter of these solder balls ranges from 0.2mm to 0.76mm (0.008in to 0.03in), with a precise 0.4mm size for ic packaging. made from sn96.5% ag3% cu0.5% alloy, they offer excellent soldering performance and durability for long-term use.
• [Materials] These leadfree solder balls are crafted from refined materials, complying with modern safety standards. they provide strong soldering capabilities without the harmful effects.
• [Versatile Application] These bga solder balls are widely used in connecting semiconductor chips, circuit templates, and pcb boards to ensure efficient transmission of electronic signals. their ultra-small ball-shaped design makes them perfect for precise soldering and reballing tasks, providing reliable connections in various electronic applications.
• [High Quantity Value] Each package contains 250,000 grains of 0.4mm solder balls, offering exceptional value for bulk reballing and soldering projects. whether for bga package soldering, filling, or maintenance, this high quantity ensures you have enough for multiple applications.